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2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 2
This collection of 80 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.
2 210,00 DH
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This collection of 80 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.
| ISBN / EAN | 9780791855768 |
|---|---|
| Auteur | Engineers, American Society of Mechanical |
| Editeur | American Society of Mechanical Engineers,U.S. |