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Introduction to Microsystem Packaging Technology
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
2 180,00 DH
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Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
| ISBN / EAN | 9781439819104 |
|---|---|
| Auteur | Jin, Yufeng (Peking University) |
| Editeur | Taylor & Francis Inc |